ESDALD05UD4

The ESDALD05UD4 is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and fast response time. The ESDALD05UD4 suited for use in USB 2.0, Firewire, DVI, and Gigabit Ethernet Interfaces.

Features and Benefits
  • Peak pulse power 88W @ 8/20μs waveform
  • Protects four I/O lines and one VCC line
  • IEC 61000-4-2 (ESD) ±15kV(air), ±8kV(contact)
  • IEC 61000-4-5 (Lightning) 5.5A (8/20μs)
  • Low capacitance
  • Low leakage current
  • Low clamping voltage
  • Meet MSL level1
  • Halogen free and RoHS compliant
Applications
  • USB 2.0
  • Digital Visual Interface (DVI)
  • IEEE 1394 Firewire Ports
  • Notebooks & Handhelds
  • Projection TV & Monitors
  • Set-top box
  • Flat Panel Displays
  • PCI Express
Parametric
Package
Quality, reliability & chemical content
Ordering
Datasheet
Type Number Symbol Parameter Conditions Min Typ/Nom Max Unit
   ESDALD05UD4 VRWM  reverse working voltage Any I/O pin to GND     5 V
VBR  reverse breakdown voltage IT = 1 mA; Any I/O pin to GND 6     V
Tj  junction temperature       150 °C
VC  clamping voltage IPP = 1 A; tp = 8/20 μs;
Any I/O pin to GND		     10 V
IPP = 5.5 A; tp = 8/20 μs;
Any I/O pin to GND		     16 V
IPP  peak pulse current 8/20μs waveform     5.5 A
IR  reverse leakage current VRWM = 5 V; Any I/O pin to GND     100 nA
Cj  Junction Capacitance VR = 0 V; f = 1 MHz;
Any I/O pin to GND		   0.3 0.5 pF
VR = 0 V; f = 1 MHz;
Any I/O pin to GND		   0.6 1 pF
Datasheet
Chemical Content

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.