WG50N65MFW1

WG50N65MFW1 uses advanced Fine Trench Field-stop IGBT technology with anti-parallel diode in TO247 package to provide extremely low VCE(sat), and excellent switching performance. This device offers Best-in-Class efficiency in hard switching and resonant topology.

Features and Benefits
  • Maximum junction temperature 175 °C
  • Positive Temperature efficient for easy paralleling
  • Very soft, fast recovery anti-parallel diode
  • Smooth & Optimized switching
  • EMI Improved Design
Applications
  • Motor control
  • PFC
  • UPS
  • Resonant converters
  • Mid to high switching frequency applications
Parametric
Package
Quality, reliability & chemical content
Ordering
Datasheet
Type Number Symbol Parameter Conditions Min Typ/Nom Max Unit
WG50N65MFW1 VCE  collector-emitter voltage       650 V
IC  collector current  TC = 25 °C     100 A
IF  diode forward current  TC = 25 °C     100 A
VCE(sat)  collector-emitter saturation voltage  VGE = 15 V; IC = 50 A; Tj = 25 °C   1.55 1.95 V
VF  diode forward voltage  VGE = 0 V; IF = 50 A; Tj = 25 °C   2   V
VGE(th)  gate-emitter threhold voltage  IC = 0.5 mA; VCE = VGE 4.3 5.4 6.5 V
Qg  gate charge  VCC = 520 V; IC = 50 A; VGE = 15 V; Tj = 25 °C   133   nC
Eon  turn-on energy  Tj = 25 °C; VCC = 400 V; IC = 50 A; VGE = 15V / 0V; RG = 10 Ω   1.38   mJ
Eoff  turn-off energy   0.72   mJ
Qr  reverse recovery charge  Tj = 25 °C; VR = 400 V; IF = 50 A; dIF/dt = 500 A/us   321   nC
Datasheet
Chemical Content

Chemical Content - WG50N65MFW1

 

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.