BYV25FD-600

Enhanced ultrafast power diode in a TO252 (DPAK) plastic package.

Features and Benefits
  • High thermal cycling performance
  • Low on-state losses
  • Low thermal resistance
  • Soft recovery characteristic
  • Surface-mountable package
Applications
  • Dual Mode (DCM and CCM) PFC
  • Power Factor Correction (PFC) for Interleaved Topology
Parametric
Package
Quality, reliability & chemical content
Ordering
Datasheet
Type Number Symbol Parameter Conditions Min Typ/Nom Max Unit
BYV25FD-600 VRRM repetitive peak reverse voltage       600 V
IF(AV) average forward current δ = 0.5  ; Tmb ≤ 121 °C; SQW     5 A
IFRM repetitive peak forward current δ = 0.5  ; tp = 25 µs; Tmb ≤ 121 °C; SQW     10 A
IFSM non-repetitive peak forward current tp = 10 ms; Tj(init) = 25 °C; SIN     60 A
tp = 8.3 ms; Tj(init) = 25 °C; SIN     66 A
VF forward voltage IF = 5 A; Tj = 25 °C   1.3 1.9 V
IF = 5 A; Tj = 150 °C   1.1 1.7 V
trr reverse recovery time IF = 1 A; VR = 30 V; dIF/dt = 100 A/µs; Tj = 25 °C   17.5 35 ns
Datasheet
Chemical Content

Chemical Content - BYV25FD-600

As a proactive and sustainable company, WeEn Semiconductors has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. WeEn Semiconductors has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. WeEn Semiconductors products are compliant to the EU Directives RoHS, ELV and the China RoHS.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.