ESDHD15BC

The ESDHDxxBC series are designed to protect voltage sensitive components which are connected to data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). Excellent clamping capability , this series offers a low leakage current in a miniature SOD323 package.

Features and Benefits
  • Peak pulse power 350W @ 8/20μs waveform
  • IEC 61000-4-2 (ESD) ±30kV(air), ±30kV(contact)
  • Protects Bi-directional I/O line
  • Low clamping voltage
  • Low leakage current
  • Meet MSL level1
  • Halogen free and RoHS compliant
Applications
  • Computer Interfaces Protection
  • Microprocessors Protection
  • Serial and Parallel Ports Protection
  • Control Signal Lines Protection
  • Power lines on PCB Protection
  • Portable instrumentation
  • Peripherals
Parametric
Package
Quality, reliability & chemical content
Ordering
Datasheet
Type Number Symbol Parameter Conditions Min Typ/Nom Max Unit
ESDHD15BC VRWM  reverse working voltage       15 V
VBR  reverse breakdown voltage  IT = 1 mA 16.5     V
Tj  junction temperature   -55   150 °C
VC  clamping voltage  IPP = 1 A; tp = 8/20 μs     24 V
 IPP = 10 A; tp = 8/20 μs     38 V
IPP  peak pulse current  8/20μs waveform     10 A
IR  reverse leakage current  VR = 15 V     1 μA
Cj  Junction Capacitance  VR = 0 V; f = 1 MHz;   40   pF
Datasheet
Chemical Content

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.