ESDHD15UB

The ESDHDxxUB Series is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications.

Features and Benefits
  • IEC 61000-4-2 (ESD) ±30 kV(air), ±30 kV(contact)
  • Protects one directional I/O line
  • Low leakage current
  • Low clamping voltage
  • Meet MSL level 1
  • Halogen free and RoHS compliant
Applications
  • Cell Phone Handsets and Accessories
  • Microprocessor based equipment
  • Personal Digital Assistants (PDA’s)
  • Notebooks / Desktops / Servers
  • Serial and Parallel Ports Protection
  • Portable Instrumentation
  • Peripherals
Parametric
Package
Quality, reliability & chemical content
Ordering
Datasheet
Type Number Symbol Parameter Conditions Min Typ/Nom Max Unit
ESDHD15UB VR  reverse working voltage       15 V
VBR  reverse breakdown voltage  IT = 1 mA 16.5     V
Tj  junction temperature   -55   150 °C
VC  clamping voltage  IPP = 1 A; tp = 8/20 μs     25 V
 IPP = 6 A; tp = 8/20 μs     35 V
IPP  peak pulse current  8/20μs waveform     6 A
IR  reverse leakage current  VR = 12 V     1 μA
Cj  Junction Capacitance  VR = 0 V; f = 1 MHz;   40   pF
Datasheet
Chemical Content

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.