ESDUDS05BF

The ESDUDS05BF is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and low capacitance. The ESDUDS05BF is suited for using in cellular phones, portable device, digital cameras, power supplies and many other portable applications.

Features and Benefits
  • DFN1006 package
  • Bidirectional ESD protection of one line
  • Extremely low diode capacitance
  • Extremely low clamping voltage to protect sensitive I/Os
  • Extremely low inductance protection path to ground
  • IEC 61000-4-2 (ESD) ±20kV(air), ±12kV(contact)
  • Halogen free and RoHS compliant
Applications
  • Cell Phone Handsets and Accessories
  • Personal Digital Assistants
  • Notebooks / Desktops / Servers
  • Digital Visual Interfaces (DVI)
  • Display Ports (DP)
  • HDMI1.3/1.4/2.0
  • USB2.0/3.0/3.1
Parametric
Package
Quality, reliability & chemical content
Ordering
Datasheet
Type Number Symbol Parameter Conditions Min Typ Max Unit
ESDUDS05BF IPP  peak pulse current tp = 8/20 μs     5 A
Tj  junction temperature   -55   150 °C
VRWM  reverse working voltage       5 V
VBR  reverse breakdown voltage IT = 1 mA 5.6     V
IR  reverse leakage current VRWM = 5 V     1 μA
VH  holding reverse voltage   2     V
VC  clamping voltage IPP = 5 A; tp = 8/20 μs     10 V
Cj  Junction Capacitance VR = 0 V; f = 1 MHz     0.4 pF
Datasheet
Chemical Content

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.