Test item：Ultrasonic testing （SAT）
Product covered： IC and discrete semi-conductor devices.
Test capability：Percentage of delamination area calculation; Defect size identification; thickness and distance measurement and other functions. 。
Such as: A-scan (point scan), B-scan (vertical scan), C-scan (horizontal scan), Through-scan (transmission scan).
Executive Standard：IPC/JEDEC
Test item：Devices decapsulation
Product covered：IC，Discrete semi-conductor devices and Module .
Decapsulation capability：Laser unpacking, chemical unpacking, sample peeling.
Executive Standard：According to customer requirement
Test item：Size measurement
Product covered：MOSFET、IGBT、DIODE、Transistor、SCR，IC and discrete semi-conductor devices.
Test capability：Stereoscopic imaging: maximum 20-200X; metallographic imaging: maximum 1000 times; digital imaging: maximum 6000 times
Executive Standard ：JEDEC，AEC or special request from customer.
Test item：X-ray inspection
Product covered：IC and discrete semi-conductor devices.
Test capability：The highest resolution is 2um. It has functions such as calculating the percentage of void area, marking the size of defects, and measuring thickness and distance. Two-dimensional scan and three-dimensional CT scan can be performed.
Executive Standard：According to customer requirement
Test item：Decapsulation
Product covered：IC and discrete semi-conductor devices.
Test capability：Chemical decapsulation
Executive Standard：According to customer requirement
Test item：Take photo
Product covered：MOSFET、IGBT、DIODE、Transistor、SCR and discrete semi-conductor devices.
Test capability：3D puzzle, high and low magnification optical microscope
Executive Standard：According to customer requirement
Test item：FIB (Focused ion beam)
Product covered：IC and discrete semi-conductor devices.
Test capability：The application of FIB (Focused Ion Beam) machine is to irradiate an ion source mixed with gallium, liquid and metal on the surface of the sample to obtain images or remove substances;
- Cross-Section Analysis: Use FIB to make cross-section faults at specific positions of the IC chip to observe the cross-section structure and material of the material, and to analyze the defects of the chip structure at a fixed point.
- Probing Pad: Lead the test point at any position in the complex IC circuit, so as to further use the probe station or E-beam to directly observe the internal signal of the IC.
Executive Standard: According to customer requirement
Test item： Probe Test
Product covered：Discrete semi-conductor devices.
Test capability：Liquid crystal method-leakage analysis, the use of liquid crystal sensing to detect IC leakage and molecular arrangement and reorganization, showing a patchy image different from other areas under the microscope, to find the leakage area that troubles the designer in the actual analysis (the fault point exceeding 10mA).
Executive Standard: According to customer requirement
Test item：I-V Curve Tracer test
Product covered：Discrete semi-conductor devices.
Test capability：Curve Tracer provides characteristic measurement of semiconductor electronic components, electrical failure analysis measurement (EFA, Electrical Failure Analysis) and curve drawing (IV-CURVE)
Executive Standard: According to customer requirement
Test item： SEM/EDX (Scanning electron microscope/energy spectrometer)
Product covered：Discrete semi-conductor devices.
Test capability：The manufacture of scanning electron microscopes is based on the interaction between electrons and matter. When a beam of high-energy incident electrons bombard the material surface, the excited area will generate secondary electrons, X-ray signals, backscattered electrons, transmitted electrons, and electromagnetic radiation generated in the visible, ultraviolet, and infrared regions. According to the signal intensity composing topography photos, the surface appearance topography can be observed at high magnification. In principle, the interaction between electrons and matter can be used to obtain information on various physical and chemical properties of the sample itself.
Executive Standard: According to customer requirement
